TDW-309 new ground curing adhesive construction video


 

TDW-309 new ground curing adhesive is composed of selected polymer emulsion and additives, suitable for laying the floor or floor tiles before running sand or dust on the ground for reinforcement. Effectively prevent dust from rising in the gaps after the floor is laid: after the ground is reinforced, the bonding force between the floor tiles and the ground is improved. At the same time, this product has a moisture-proof effect, effective penetration reinforcement, the wood floor and floor tiles for a certain moisture-proof protection.

Can be applied to cement mortar, concrete ground reinforcement treatment.